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| MX29LV800C T/B FEATURES 8M-BIT [1Mx8/512K x16] CMOS SINGLE VOLTAGE 3V ONLY FLASH MEMORY * Ready/Busy# pin (RY/BY#) - Provides a hardware method of detecting program or erase operation completion * Sector protection - Hardware method to disable any combination of sectors from program or erase operations - Temporary sector unprotected allows code changes in previously locked sectors. * CFI (Common Flash Interface) compliant - Flash device parameters stored on the device and provide the host system to access * 100,000 minimum erase/program cycles * Latch-up protected to 100mA from -1V to VCC+1V * Boot Sector Architecture - T = Top Boot Sector - B = Bottom Boot Sector * Package type: - 44-pin SOP - 48-pin TSOP - 48-ball CSP (6 x 8mm) - 48-ball CSP (4 x 6mm) - All Pb-free devices are RoHS Compliant * Compatibility with JEDEC standard - Pinout and software compatible with single-power supply Flash * 10 years data retention * Extended single - supply voltage range 2.7V to 3.6V * 1,048,576 x 8/524,288 x 16 switchable * Single power supply operation - 3.0V only operation for read, erase and program operation * Fast access time: 45R/55R/70/90ns * Low power consumption - 30mA maximum active current - 0.2uA typical standby current * Command register architecture - Byte/word Programming (9us/11us typical) - Sector Erase (Sector structure 16K-Bytex1, 8K-Bytex2, 32K-Bytex1, and 64K-Byte x15) * Fully compatible with MX29LV800BT/BB device * Auto Erase (chip & sector) and Auto Program - Automatically erase any combination of sectors with Erase Suspend capability - Automatically program and verify data at specified address * Erase suspend/Erase Resume - Suspends sector erase operation to read data from, or program data to, any sector that is not being erased, then resumes the erase * Status Reply - Data# polling & Toggle bit for detection of program and erase operation completion GENERAL DESCRIPTION The MX29LV800C T/B is a 8-mega bit Flash memory organized as 1M bytes of 8 bits or 512K words of 16 bits. MXIC's Flash memories offer the most cost-effective and reliable read/write non-volatile random access memory. The MX29LV800C T/B is packaged in 44-pin SOP, 48-pin TSOP, and 48-ball CSP. It is designed to be reprogrammed and erased in system or in standard EPROM programmers. The standard MX29LV800C T/B offers access time as fast as 45ns, allowing operation of high-speed microprocessors without wait states. To eliminate bus contention, the MX29LV800C T/B has separate chip enable (CE#) and output enable (OE#) controls. MXIC's Flash memories augment EPROM functionality with in-circuit electrical erasure and programming. The MX29LV800C T/B uses a command register to manage this functionality. The command register allows for 100% P/N:PM1183 TTL level control inputs and fixed power supply levels during erase and programming, while maintaining maximum EPROM compatibility. MXIC Flash technology reliably stores memory contents even after 100,000 erase and program cycles. The MXIC cell is designed to optimize the erase and programming mechanisms. In addition, the combination of advanced tunnel oxide processing and low internal electric fields for erase and program operations produces reliable cycling. The MX29LV800C T/B uses a 2.7V~3.6V VCC supply to perform the High Reliability Erase and auto Program/Erase algorithms. The highest degree of latch-up protection is achieved with MXIC's proprietary non-epi process. Latch-up protection is proved for stresses up to 100 milliamperes on address and data pin from -1V to VCC + 1V. REV. 1.4, APR. 24, 2006 1 MX29LV800C T/B PIN CONFIGURATIONS 44 SOP(500 mil) RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE# GND OE# Q0 Q8 Q1 Q9 Q2 Q10 Q3 Q11 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 RESET# WE# A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC PIN DESCRIPTION SYMBOL PIN NAME A0~A18 Q0~Q14 Q15/A-1 CE# WE# BYTE# RESET# OE# RY/BY# VCC GND NC Address Input Data Input/Output Q15(Word mode)/LSB addr(Byte mode) Chip Enable Input Write Enable Input Word/Byte Selection input Hardware Reset Pin Output Enable Input Ready/Busy Output Power Supply Pin (2.7V~3.6V) Ground Pin Pin Not Connected Internally 48 TSOP (Standard Type) (12mm x 20mm) A15 A14 A13 A12 A11 A10 A9 A8 NC NC WE# RESET# NC NC RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE# GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC Q11 Q3 Q10 Q2 Q9 Q1 Q8 Q0 OE# GND CE# A0 MX29LV800CT/CB MX29LV800CT/CB P/N:PM1183 REV. 1.4, APR. 24, 2006 2 MX29LV800C T/B 48-Ball CSP (Ball Pitch = 0.8 mm, Top View, Balls Facing Down, 6 x 8 mm) 6 A13 A12 A14 A15 A16 BYTE# Q15/ A-1 GND 5 A9 A8 A10 A11 Q7 Q14 Q13 Q6 4 WE# RESET# NC NC Q5 Q12 VCC Q4 3 RY/ BY# A7 NC A18 NC Q2 Q10 Q11 Q3 2 A17 A6 A5 Q0 Q8 Q9 Q1 1 A3 A4 A2 A1 A0 CE# OE# GND A B C D E F G H 48-Ball CSP (Balls Facing Down, 4 x 6 mm) 6 A2 A4 A6 A17 NC NC WE# NC A9 A11 5 A1 A3 A7 NC NC A10 A13 A14 4 A0 A5 A18 A8 A12 A15 3 CE# Q8 Q10 Q4 Q11 A16 2 GND OE# Q9 NC NC Q5 Q6 Q7 1 Q0 Q1 Q2 Q3 VCC Q12 Q13 Q14 Q15 GND A B C D E F G H J K L P/N:PM1183 REV. 1.4, APR. 24, 2006 3 MX29LV800C T/B BLOCK STRUCTURE TABLE 1: MX29LV800CT SECTOR ARCHITECTURE Sector SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7 SA8 SA9 SA10 SA11 SA12 SA13 SA14 SA15 SA16 SA17 SA18 Sector Size Byte Mode Word Mode 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 32Kbytes 8Kbytes 8Kbytes 16Kbytes 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 16Kwords 4Kwords 4Kwords 8Kwords Address range Byte Mode (x8) 00000h-0FFFFh 10000h-1FFFFh 20000h-2FFFFh 30000h-3FFFFh 40000h-4FFFFh 50000h-5FFFFh 60000h-6FFFFh 70000h-7FFFFh 80000h-8FFFFh 90000h-9FFFFh A0000h-AFFFFh B0000h-BFFFFh C0000h-CFFFFh D0000h-DFFFFh E0000h-EFFFFh F0000h-F7FFFh F8000h-F9FFFh FA000h-FBFFFh FC000h-FFFFFh Word Mode (x16) 00000h-07FFFh 08000h-0FFFFh 10000h-17FFFh 18000h-1FFFFh 20000h-27FFFh 28000h-2FFFFh 30000h-37FFFh 38000h-3FFFFh 40000h-47FFFh 48000h-4FFFFh 50000h-57FFFh 58000h-5FFFFh 60000h-67FFFh 68000h-6FFFFh 70000h-77FFFh 78000h-7BFFFh 7C000h-7CFFFh 7D000h-7DFFFh 7E000h-7FFFFh 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 1 1 1 Sector Address A18 A17 A16 A15 A14 A13 A12 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 1 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 1 1 1 X X X X X X X X X X X X X X X 0 1 1 1 X X X X X X X X X X X X X X X X 0 0 1 X X X X X X X X X X X X X X X X 0 1 X Note: Byte mode:address range A18:A-1, word mode:address range A18:A0. P/N:PM1183 REV. 1.4, APR. 24, 2006 4 MX29LV800C T/B TABLE 2: MX29LV800CB SECTOR ARCHITECTURE Sector SA0 SA1 SA2 SA3 SA4 SA5 SA6 SA7 SA8 SA9 SA10 SA11 SA12 SA13 SA14 SA15 SA16 SA17 SA18 Sector Size Byte Mode Word Mode 16Kbytes 8Kbytes 8Kbytes 32Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 64Kbytes 8Kwords 4Kwords 4Kwords 16Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords 32Kwords Address range Byte Mode (x8) 00000h-03FFFh 04000h-05FFFh 06000h-07FFFh 08000h-0FFFFh 10000h-1FFFFh 20000h-2FFFFh 30000h-3FFFFh 40000h-4FFFFh 50000h-5FFFFh 60000h-6FFFFh 70000h-7FFFFh 80000h-8FFFFh 90000h-9FFFFh A0000h-AFFFFh B0000h-BFFFFh C0000h-CFFFFh D0000h-DFFFFh E0000h-EFFFFh F0000h-FFFFFh Word Mode (x16) 00000h-01FFFh 02000h-02FFFh 03000h-03FFFh 04000h-07FFFh 08000h-0FFFFh 10000h-17FFFh 18000h-1FFFFh 20000h-27FFFh 28000h-2FFFFh 30000h-37FFFh 38000h-3FFFFh 40000h-47FFFh 48000h-4FFFFh 50000h-57FFFh 58000h-5FFFFh 60000h-67FFFh 68000h-6FFFFh 70000h-77FFFh 78000h-7FFFFh 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 Sector Address A18 A17 A16 A15 A14 A13 A12 0 0 0 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 0 1 X X X X X X X X X X X X X X X 0 1 1 X X X X X X X X X X X X X X X X X 0 1 X X X X X X X X X X X X X X X X Note: Byte mode:address range A18:A-1, word mode:address range A18:A0. P/N:PM1183 REV. 1.4, APR. 24, 2006 5 MX29LV800C T/B BLOCK DIAGRAM CE# OE# WE# RESET# CONTROL INPUT LOGIC PROGRAM/ERASE HIGH VOLTAGE WRITE STATE MACHINE (WSM) STATE REGISTER FLASH ARRAY ARRAY SOURCE HV X-DECODER ADDRESS LATCH A0-A18 AND BUFFER Y-PASS GATE COMMAND DATA DECODER Y-DECODER SENSE AMPLIFIER PGM DATA HV COMMAND DATA LATCH PROGRAM DATA LATCH Q0-Q15/A-1 I/O BUFFER P/N:PM1183 REV. 1.4, APR. 24, 2006 6 MX29LV800C T/B AUTOMATIC PROGRAMMING The MX29LV800C T/B is byte programmable using the Automatic Programming algorithm. The Automatic Programming algorithm makes the external system do not need to have time out sequence nor to verify the data programmed. The typical chip programming time at room temperature of the MX29LV800C T/B is less than 10 seconds. dard microprocessor write timings. The device will automatically pre-program and verify the entire array. Then the device automatically times the erase pulse width, provides the erase verification, and counts the number of sequences. A status bit toggling between consecutive read cycles provides feedback to the user as to the status of the erasing operation. Register contents serve as inputs to an internal statemachine which controls the erase and programming circuitry. During write cycles, the command register internally latches address and data needed for the programming and erase operations. During a system write cycle, addresses are latched on the falling edge, and data are latched on the rising edge of WE# or CE#, whichever happens first. MXIC's Flash technology combines years of EPROM experience to produce the highest levels of quality, reliability, and cost effectiveness. The MX29LV800C T/B electrically erases all bits simultaneously using FowlerNordheim tunneling. The bytes are programmed by using the EPROM programming mechanism of hot electron injection. During a program cycle, the state-machine will control the program sequences and command register will not respond to any command set. During a Sector Erase cycle, the command register will only respond to Erase Suspend command. After Erase Suspend is completed, the device stays in read mode. After the state machine has completed its task, it will allow the command register to respond to its full command set. AUTOMATIC PROGRAMMING ALGORITHM MXIC's Automatic Programming algorithm requires the user to only write program set-up commands (including 2 unlock write cycle and A0H) and a program command (program data and address). The device automatically times the programming pulse width, provides the program verification, and counts the number of sequences. A status bit similar to DATA# polling and a status bit toggling between consecutive read cycles, provide feedback to the user as to the status of the programming operation. Refer to write operation status, table 8, for more information on these status bits. AUTOMATIC CHIP ERASE The entire chip is bulk erased using 10 ms erase pulses according to MXIC's Automatic Chip Erase algorithm. Typical erasure at room temperature is accomplished in less than 25 second. The Automatic Erase algorithm automatically programs the entire array prior to electrical erase. The timing and verification of electrical erase are controlled internally within the device. AUTOMATIC SELECT AUTOMATIC SECTOR ERASE The MX29LV800C T/B is sector(s) erasable using MXIC's Auto Sector Erase algorithm. The Automatic Sector Erase algorithm automatically programs the specified sector(s) prior to electrical erase. The timing and verification of electrical erase are controlled internally within the device. An erase operation can erase one sector, multiple sectors, or the entire device. The auto select mode provides manufacturer and device identification, and sector protection verification, through identifier codes output on Q7~Q0. This mode is mainly adapted for programming equipment on the device to be programmed with its programming algorithm. When programming by high voltage method, automatic select mode requires VID (11.5V to 12.5V) on address pin A9 and other address pin A6, A1 and A0 as referring to Table 3. In addition, to access the automatic select codes in-system, the host can issue the automatic select command through the command register without requiring VID, as shown in table 5. To verify whether or not sector being protected, the sector address must appear on the appropriate highest order REV. 1.4, APR. 24, 2006 AUTOMATIC ERASE ALGORITHM MXIC's Automatic Erase algorithm requires the user to write commands to the command register using stanP/N:PM1183 7 MX29LV800C T/B address bit (see Table 1 and Table 2). The rest of address bits, as shown in table 3, are don't care. Once all necessary bits have been set as required, the programming equipment may read the corresponding identifier code on Q7~Q0. TABLE 3. MX29LV800C T/B AUTO SELECT MODE OPERATION A18 A11 Description Manufacturer Code Read ID Device ID Device ID (Bottom Boot Block) Sector Protection Verification Word Byte Word Byte Silicon (Top Boot Block) Mode CE# OE# WE# L L L L L L L L L L L L H H H H H H | X X X X X SA | X X X X X X VID VID VID VID VID VID A12 A10 A9 A8 | A7 X X X X X X L L L L L L A6 A5 A1 A0 | A2 X X X X X X L L L L L H L H H H H L C2H 22DAH XXDAH 225BH XX5BH XX01H (protected) XX00H (unprotected) NOTE:SA=Sector Address, X=Don't Care, L=Logic Low, H=Logic High Q15~Q0 P/N:PM1183 REV. 1.4, APR. 24, 2006 8 MX29LV800C T/B QUERY COMMAND AND COMMON FLASH INTERFACE (CFI) MODE MX29LV800C T/B is capable of operating in the CFI mode. This mode all the host system to determine the manufacturer of the device such as operating parameters and configuration. Two commands are required in CFI mode. Query command of CFI mode is placed first, then the Reset command exits CFI mode. These are described in Table 4. The single cycle Query command is valid only when the device is in the Read mode, including Erase Suspend, Standby mode, and Read ID mode; however, it is ignored otherwise. The Reset command exits from the CFI mode to the Read mode, or Erase Suspend mode, or read ID mode. The command is valid only when the device is in the CFI mode. TABLE 4-1. CFI mode: Identification Data Values (All values in these tables are in hexadecimal) Description Address (Byte Mode) Query-unique ASCII string "QRY" 20 22 24 Primary vendor command set and control interface ID code 26 28 Address for primary algorithm extended query table 2A 2C Alternate vendor command set and control interface ID code (none) 2E 30 Address for secondary algorithm extended query table (none) 32 34 Address (Word Mode) 10 11 12 13 14 15 16 17 18 19 1A Data 0051 0052 0059 0002 0000 0040 0000 0000 0000 0000 0000 TABLE 4-2. CFI Mode: System Interface Data Values (All values in these tables are in hexadecimal) Description VCC supply, minimum (2.7V) VCC supply, maximum (3.6V) VPP supply, minimum (none) VPP supply, maximum (none) Typical timeout for single word/byte write (2N us) Typical timeout for Minimum size buffer write (2N us) Typical timeout for individual block erase (2N ms) Typical timeout for full chip erase (2N ms) Maximum timeout for single word/byte write times (2N X Typ) Maximum timeout for buffer write times (2N X Typ) Maximum timeout for individual block erase times (2N X Typ) Maximum timeout for full chip erase times (not supported) P/N:PM1183 Address (Byte Mode) 36 38 3A 3C 3E 40 42 44 46 48 4A 4C Address (Word Mode) 1B 1C 1D 1E 1F 20 21 22 23 24 25 26 Data 0027 0036 0000 0000 0004 0000 000A 0000 0005 0000 0004 0000 REV. 1.4, APR. 24, 2006 9 MX29LV800C T/B TABLE 4-3. CFI Mode: Device Geometry Data Values (All values in these tables are in hexadecimal) Description Device size (2N bytes) Flash device interface code (refer to the CFI publication 100) Maximum number of bytes in multi-byte write (not supported) Number of erase block regions Erase block region 1 information (refer to the CFI publication 100) Address (Byte Mode) 4E 50 52 54 56 58 5A 5C 5E 60 62 64 66 68 6A 6C 6E 70 72 74 76 78 Address (Word Mode) 27 28 29 2A 2B 2C 2D 2E 2F 30 31 32 33 34 35 36 37 38 39 3A 3B 3C Data 0014 0002 0000 0000 0000 0004 0000 0000 0040 0000 0001 0000 0020 0000 0000 0000 0080 0000 000E 0000 0000 0001 Erase block region 2 information Erase block region 3 information Erase block region 4 information TABLE 4-4. CFI Mode: Primary Vendor-Specific Extended Query Data Values (All values in these tables are in hexadecimal) Description Query-unique ASCII string "PRI" Address (Byte Mode) 80 82 84 86 88 8A 8C 8E 90 92 94 96 98 Address (Word Mode) 40 41 42 43 44 45 46 47 48 49 4A 4B 4C Data 0050 0052 0049 0031 0030 0000 0002 0001 0001 0004 0000 0000 0000 Major version number, ASCII Minor version number, ASCII Address sensitive unlock (0=required, 1= not required) Erase suspend (2= to read and write) Sector protect (N= # of sectors/group) Temporary sector unprotected (1=supported) Sector protect/unprotected scheme Simultaneous R/W operation (0=not supported) Burst mode type (0=not supported) Page mode type (0=not supported) P/N:PM1183 REV. 1.4, APR. 24, 2006 10 MX29LV800C T/B TABLE 5. MX29LV800C T/B COMMAND DEFINITIONS First Bus Cycle Second Bus Cycle Third Bus Cycle Fourth Bus Cycle Data Fifth Bus Cycle Addr Sixth Bus Cycle Data Addr Data Command Bus Cycle Addr Reset Read Read Silicon ID Word Byte Sector Protect Verify Byte 4 Word 1 1 4 4 4 Data Addr Data Addr Data Addr XXXH F0H RA RD 55H 55H 55H 555H AAAH 555H 90H ADI 90H ADI 90H (SA) x02H AAAH AAH 555H 55H AAAH 90H (SA) x04H DDI DDI XX00H XX01H 00H 01H PD PD 2AAH 55H 555H 55H 2AAH 55H 555H 55H 555H 10H AAAH 10H SA SA 30H 30H 555H AAH 2AAH AAAH AAH 555H 555H AAH 2AAH Program Word Byte 4 4 6 6 6 6 1 1 1 1 555H AAH 2AAH AAAH AAH 555H 555H AAH 2AAH AAAH AAH 555H 555H AAH 2AAH AAAH AAH 555H XXXH B0H XXXH 30H 55H AAH 98 98 55H 55H 55H 55H 55H 55H 555H AAAH 555H AAAH 555H AAAH A0H PA A0H PA Chip Erase Word Byte 80H 555H AAH 80H AAAH AAH 80H 555H AAH 80H AAAH AAH Sector Erase Word Byte Sector Erase Suspend Sector Erase Resume CFI Query Word Byte Note: 1. ADI = Address of Device identifier; A1=0, A0 = 0 for manufacturer code,A1=0, A0 = 1 for device code. A2-A18=do not care. (Refer to table 3) DDI = Data of Device identifier : C2H for manufacture code, 22DA/DA(Top), and 225B/5B(Bottom) for device code. X = X can be VIL or VIH RA=Address of memory location to be read. RD=Data to be read at location RA. 2. PA = Address of memory location to be programmed. PD = Data to be programmed at location PA. SA = Address of the sector. 3. The system should generate the following address patterns: 555H or 2AAH to Address A10~A0 in word mode/AAAH or 555H to Address A10~A-1 in byte mode. Address bit A11~A18=X=Don't care for all address commands except for Program Address (PA) and Sector Address (SA). Write Sequence may be initiated with A11~A18 in either state. 4. For Sector Protect Verify operation: If read out data is 01H, it means the sector has been protected. If read out data is 00H, it means the sector is still not being protected. 5. Any number of CFI data read cycle are permitted. P/N:PM1183 REV. 1.4, APR. 24, 2006 11 MX29LV800C T/B COMMAND DEFINITIONS Device operations are selected by writing specific address and data sequences into the command register. Writing incorrect address and data values or writing them in the improper sequence will reset the device to the read mode. Table 5 defines the valid register command sequences. Note that the Erase Suspend (B0H) and Erase Resume (30H) commands are valid only while the Sector Erase operation is in progress. TABLE 6. MX29LV800C T/B BUS OPERATION ADDRESS DESCRIPTION CE# OE# WE# RESET# A18 A10 A9 A12 A11 Read L L H H A8 A7 AIN A6 A5 A1 A0 A2 Dout Q0~Q7 Q8~Q15 BYTE =VIH Dout BYTE =VIL Q8~Q14 =High Z Q15=A-1 Write Reset Temporary sector unlock Output Disable Standby L X X L Vcc 0.3V Sector Protect Chip Unprotected Sector Protection Verify L L L H H L L L H H X X H X L X X H X H L VID H Vcc 0.3V VID VID H SA X SA X X X X X VID X X X L H L X X X H H H L L L DIN DIN CODE(5) X X X X X X AIN X AIN X X DIN(3) High Z DIN High Z High Z DIN High Z DIN High Z High Z High Z High Z High Z High Z NOTES: 1. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 5. 2. VID is the Silicon-ID-Read high voltage, 11.5V to 12.5V. 3. Refer to Table 5 for valid Data-In during a write operation. 4. X can be VIL or VIH. 5. Code=00H/XX00H means unprotected. Code=01H/XX01H means protected. 6. A18~A12=Sector address for sector protect. 7. The sector protect and chip unprotected functions may also be implemented via programming equipment. P/N:PM1183 REV. 1.4, APR. 24, 2006 12 MX29LV800C T/B REQUIREMENTS FOR READING ARRAY DATA To read array data from the outputs, the system must drive the CE# and OE# pins to VIL. CE# is the power control and selects the device. OE# is the output control and gates array data to the output pins. WE# should remain at VIH. The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This ensures that no spurious alteration of the memory content occurs during the power transition. No command is necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid address on the device address inputs produce valid data on the device data outputs. The device remains enabled for read access until the command register contents are altered. STANDBY MODE When using both pins of CE# and RESET#, the device enter CMOS Standby with both pins held at Vcc 0.3V. If CE# and RESET# are held at VIH, but not within the range of VCC 0.3V, the device will still be in the standby mode, but the standby current will be larger. During Auto Algorithm operation, Vcc active current (Icc2) is required even CE# = "H" until the operation is completed. The device can be read with standard access time (tCE) from either of these standby modes, before it is ready to read data. OUTPUT DISABLE With the OE# input at a logic high level (VIH), output from the devices are disabled. This will cause the output pins to be in a high impedance state. WRITE COMMANDS/COMMAND SEQUENCES To program data to the device or erase sectors of memory , the system must drive WE# and CE# to VIL, and OE# to VIH. An erase operation can erase one sector, multiple sectors , or the entire device. Table indicates the address space that each sector occupies. A "sector address" consists of the address bits required to uniquely select a sector. The "Writing specific address and data commands or sequences into the command register initiates device operations. Table 1 defines the valid register command sequences. Writing incorrect address and data values or writing them in the improper sequence resets the device to reading array data. Section has details on erasing a sector or the entire chip, or suspending/resuming the erase operation. After the system writes the autoselect command sequence, the device enters the autoselect mode. The system can then read autoselect codes from the internal register (which is separate from the memory array) on Q7-Q0. Standard read cycle timings apply in this mode. Refer to the Autoselect Mode and Autoselect Command Sequence section for more information. ICC2 in the DC Characteristics table represents the active current specification for the write mode. The "AC Characteristics" section contains timing specification table and timing diagrams for write operations. RESET# OPERATION The RESET# pin provides a hardware method of resetting the device to reading array data. When the RESET# pin is driven low for at least a period of tRP, the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET# pulse. The device also resets the internal state machine to reading array data. The operation that was interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure data integrity Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS0.3V, the device draws CMOS standby current (ICC4). If RESET# is held at VIL but not within VSS0.3V, the standby current will be greater. The RESET# pin may be tied to system reset circuitry. A system reset would that also reset the Flash memory, enabling the system to read the boot-up firmware from the Flash memory. If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a "0" (busy) until the internal reset operation is complete, which requires a time of tREADY (during Embedded Algorithms). The system can thus monitor RY/BY# to determine whether the reset operation is complete. If RESET# is asserted when a pro- P/N:PM1183 REV. 1.4, APR. 24, 2006 13 MX29LV800C T/B gram or erase operation is completed within a time of tREADY (not during Embedded Algorithms). The system can read data tRH after the RESET# pin returns to VIH. Refer to the AC Characteristics tables for RESET# parameters and to Figure 22 for the timing diagram. The Automatic Chip Erase does not require the device to be entirely pre-programmed prior to executing the Automatic Chip Erase. Upon executing the Automatic Chip Erase, the device will automatically program and verify the entire memory for an all-zero data pattern. When the device is automatically verified to contain an all-zero pattern, a self-timed chip erase and verify begin. The erase and verify operations are completed when the data on Q7 is "1" at which time the device returns to the Read mode. The system is not required to provide any control or timing during these operations. When using the Automatic Chip Erase algorithm, note that the erase automatically terminates when adequate erase margin has been achieved for the memory array (no erase verification command is required). If the Erase operation was unsuccessful, the data on Q5 is "1" (see Table 8), indicating the erase operation exceed internal timing limit. The automatic erase begins on the rising edge of the last WE# or CE# pulse, whichever happens first in the command sequence and terminates when the data on Q7 is "1" at which time the device returns to the Read mode, or the data on Q6 stops toggling for two consecutive read cycles at which time the device returns to the Read mode. READ/RESET COMMAND The read or reset operation is initiated by writing the read/ reset command sequence into the command register. Microprocessor read cycles retrieve array data. The device remains enabled for reads until the command register contents are altered. If program-fail or erase-fail happen, the write of F0H will reset the device to abort the operation. A valid command must then be written to place the device in the desired state. SILICON-ID READ COMMAND Flash memories are intended for use in applications where the local CPU alters memory contents. As such, manufacturer and device codes must be accessible while the device resides in the target system. PROM programmers typically access signature codes by raising A9 to a high voltage (VID). However, multiplexing high voltage onto address lines is not generally desired system design practice. The MX29LV800C T/B contains a Silicon-ID-Read operation to supple traditional PROM programming methodology. The operation is initiated by writing the read silicon ID command sequence into the command register. Following the command write, a read cycle with A1=VIL, A0=VIL retrieves the manufacturer code of C2H/ 00C2H. A read cycle with A1=VIL, A0=VIH returns the device code of DAH/22DAH for MX29LV800CT, 5BH/ 225BH for MX29LV800CB. SET-UP AUTOMATIC CHIP/SECTOR ERASE COMMANDS Chip erase is a six-bus cycle operation. There are two "unlock" write cycles. These are followed by writing the "set-up" command 80H. Two more "unlock" write cycles are then followed by the chip erase command 10H or sector erase command 30H. P/N:PM1183 REV. 1.4, APR. 24, 2006 14 MX29LV800C T/B TABLE 7. SILICON ID CODE Pins Manufacture code Device code for MX29LV800CT Device code for MX29LV800CB Sector Protection Verification A0 VIL VIL VIH VIH VIH VIH X X A1 VIL VIL VIL VIL VIL VIL VIH VIH Q15~Q8 00H X 22H X 22H X X X Q7 1 1 1 1 0 0 0 0 Q6 1 1 1 1 1 1 0 0 Q5 0 0 0 0 0 0 0 0 Q4 0 0 1 1 1 1 0 0 Q3 0 0 1 1 1 1 0 0 Q2 0 0 0 0 0 0 0 0 Q1 1 1 1 1 1 1 0 0 Q0 0 0 0 0 1 1 1 0 Code (Hex) 00C2H C2H 22DAH DAH 225BH 5BH 01H (Protected) 00H (Unprotected) Word Byte Word Byte Word Byte Word Byte READING ARRAY DATA The device is automatically set to reading array data after device power-up. No commands are required to retrieve data. The device is also ready to read array data after completing an Automatic Program or Automatic Erase algorithm. After the device accepts an Erase Suspend command, the device enters the Erase Suspend mode. The system can read array data using the standard read timings, except that if it reads at an address within erasesuspended sectors, the device outputs status data. After completing a programming operation in the Erase Suspend mode, the system may once again read array data with the same exception. See "Erase Suspend/Erase Resume Commands" for more information on this mode. The system must issue the reset command to re-enable the device for reading array data if Q5 goes high, or while in the autoselect mode. See the "Reset Command" section, next. RESET COMMAND Writing the reset command to the device resets the device to reading array data. Address bits are don't care for this command. The reset command may be written between the sequence cycles in an erase command sequence before erasing begins. This resets the device to reading array data. Once erasure begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in a program command sequence before programming begins. This resets the device to reading array data (also applies to programming in Erase Suspend mode). Once programming begins, however, the device ignores reset commands until the operation is complete. The reset command may be written between the sequence cycles in an SILICON ID READ command sequence. Once in the SILICON ID READ mode, the reset command must be written to return to reading array data (also applies to SILICON ID READ during Erase Suspend). If Q5 goes high during a program or erase operation, writing the reset command returns the device to reading array data (also applies during Erase Suspend). P/N:PM1183 REV. 1.4, APR. 24, 2006 15 MX29LV800C T/B SECTOR ERASE COMMANDS The Automatic Sector Erase does not require the device to be entirely pre-programmed prior to executing the Automatic Sector Erase Set-up command and Automatic Sector Erase command. Upon executing the Automatic Sector Erase command, the device will automatically program and verify the sector(s) memory for an all-zero data pattern. The system is not required to provide any control or timing during these operations. When the sector(s) is automatically verified to contain an all-zero pattern, a self-timed sector erase and verify begin. The erase and verify operations are complete when either the data on Q7 is "1" at which time the device returns to the Read mode, or the data on Q6 stops toggling for two consecutive read cycles at which time the device returns to the Read mode. The system is not required to provide any control or timing during these operations. When using the Automatic sector Erase algorithm, note that the erase automatically terminates when adequate erase margin has been achieved for the memory array (no erase verification command is required). Sector erase is a six-bus cycle operation. There are two "unlock" write cycles. These are followed by writing the set-up command 80H. Two more "unlock" write cycles are then followed by the sector erase command 30H. The sector address is latched on the falling edge of WE# or CE#, whichever happens later, while the command (data) is latched on the rising edge of WE# or CE#, whichever happens first. Sector addresses selected are loaded into internal register on the sixth falling edge of WE# or CE#, whichever happens later. Each successive sector load cycle started by the falling edge of WE# or CE#, whichever happens later must begin within 50us from the rising edge of the preceding WE# or CE#, whichever happens first. Otherwise, the loading period ends and internal auto sector erase cycle starts. (Monitor Q3 to determine if the sector erase timer window is still open, see section Q3, Sector Erase Timer.) Any command other than Sector Erase (30H) or Erase Suspend (B0H) during the time-out period resets the device to read mode. Erase operation. When the Erase Suspend Command is issued during the sector erase operation, the device requires a maximum 20us to suspend the sector erase operation. However, when the Erase Suspend command is written during the sector erase time-out, the device immediately terminates the time-out period and suspends the erase operation. After this command has been executed, the command register will initiate erase suspend mode. The state machine will return to read mode automatically after suspend is ready. At this time, state machine only allows the command register to respond to Erase Resume, program data to , or read data from any sector not selected for erasure. The system can determine the status of the program operation using the Q7 or Q6 status bits, just as in the standard program operation. After an erase-suspend program operation is complete, the system can once again read array data within non-suspended sectors. ERASE RESUME This command will cause the command register to clear the suspend state and return back to Sector Erase mode but only if an Erase Suspend command was previously issued. Erase Resume will not have any effect in all other conditions. Another Erase Suspend command can be written after the chip has resumed erasing. The minimum time from Erase Resume to next Erase Suspend is 400us. Repeatedly suspending the device more often may have undetermined effects. WORD/BYTE PROGRAM COMMAND SEQUENCE The device programs one byte of data for each program operation. The command sequence requires four bus cycles, and is initiated by writing two unlock write cycles, followed by the program set-up command. The program address and data are written next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further controls or timings. The device automatically generates the program pulses and verifies the programmed cell margin. Table 1 shows the address and data requirements for the byte program command sequence. When the Embedded Program algorithm is complete, the device then returns to reading array data and addresses are no longer latched. The system can determine the status of the program operation by using Q7, Q6, or RY/ ERASE SUSPEND This command only has meaning while the state machine is executing Automatic Sector Erase operation, and therefore will only be responded during Automatic Sector P/N:PM1183 REV. 1.4, APR. 24, 2006 16 MX29LV800C T/B BY#. See "Write Operation Status" for information on these status bits. Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a hardware reset immediately terminates the programming operation. The Byte Program command sequence should be reinitiated once the device has reset to reading array data, to ensure data integrity. Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed from a "0" back to a "1". Attempting to do so may halt the operation and set Q5 to "1" , or cause the DATA# polling algorithm to indicate the operation was successful. However, a succeeding read will show that the data is still "0". Only erase operations can convert a "0" to a "1". is complete, or if the device enters the Erase Suspend mode, DATA# polling produces a "1" on Q7. This is analogous to the complement/true datum out-put described for the Automatic Program algorithm: the erase function changes all the bits in a sector to "1" prior to this, the device outputs the "complement," or "0". The system must provide an address within any of the sectors selected for erasure to read valid status information on Q7. After an erase command sequence is written, if all sectors selected for erasing are protected, DATA# polling on Q7 is active for approximately 100 us, then the device returns to reading array data. If not all selected sectors are protected, the Automatic Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. When the system detects Q7 has changed from the complement to true data, it can read valid data at Q7-Q0 on the following read cycles. This is because Q7 may change asynchronously with Q0-Q6 while Output Enable (OE#) is asserted low. WRITE OPERATION STATUS The device provides several bits to determine the status of a write operation: Q2, Q3, Q5, Q6, Q7, and RY/ BY#. Table 10 and the following subsections describe the functions of these bits. Q7, RY/BY#, and Q6 each offer a method for determining whether a program or erase operation is complete or in progress. These three bits are discussed first. RY/BY# : Ready/Busy The RY/BY# is a dedicated, open-drain output pin that indicates whether an Automatic Erase/Program algorithm is in progress or complete. The RY/BY# status is valid after the rising edge of the final WE# or CE#, whichever happens first, in the command sequence. Since RY/BY# is an open-drain output, several RY/BY# pins can be tied together in parallel with a pull-up resistor to VCC. If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the Erase Suspend mode.) If the output is high (Ready), the device is ready to read array data (including during the Erase Suspend mode), or is in the standby mode. Table 8 shows the outputs for RY/BY# during write operation. Q7: Data# Polling The DATA# polling bit, Q7, indicates to the host system whether an Automatic Algorithm is in progress or completed, or whether the device is in Erase Suspend. DATA# polling is valid after the rising edge of the final WE# pulse in the program or erase command sequence. During the Automatic Program algorithm, the device outputs on Q7 the complement of the datum programmed to Q7. This Q7 status also applies to programming during Erase Suspend. When the Automatic Program algorithm is complete, the device outputs the datum programmed to Q7. The system must provide the program address to read valid status information on Q7. If a program address falls within a protected sector, DATA# polling on Q7 is active for approximately 1 us, then the device returns to reading array data. During the Automatic Erase algorithm, DATA# polling produces a "0" on Q7. When the Automatic Erase algorithm Q6:Toggle BIT I Toggle Bit I on Q6 indicates whether an Automatic Program or Erase algorithm is in progress or complete, or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is valid after the rising edge of the final WE# or CE#, whichever P/N:PM1183 REV. 1.4, APR. 24, 2006 17 MX29LV800C T/B happens first, in the command sequence (prior to the program or erase operation), and during the sector timeout. During an Automatic Program or Erase algorithm operation, successive read cycles to any address cause Q6 to toggle. The system may use either OE# or CE# to control the read cycles. When the operation is complete, Q6 stops toggling. After an erase command sequence is written, if all sectors selected for erasing are protected, Q6 toggles and returns to reading array data. If not all selected sectors are protected, the Automatic Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected. The system can use Q6 and Q2 together to determine whether a sector is actively erasing or is erase suspended. When the device is actively erasing (that is, the Automatic Erase algorithm is in progress), Q6 toggling. When the device enters the Erase Suspend mode, Q6 stops toggling. However, the system must also use Q2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use Q7. If a program address falls within a protected sector, Q6 toggles for approximately 2 us after the program command sequence is written, then returns to reading array data. Q6 also toggles during the erase-suspend-program mode, and stops toggling once the Automatic Program algorithm is complete. Table 8 shows the outputs for Toggle Bit I on Q6. is actively erasing or is erase-suspended. Q6, by comparison, indicates whether the device is actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sectors and mode information. Refer to Table 8 to compare outputs for Q2 and Q6. Reading Toggle Bits Q6/ Q2 Whenever the system initially begins reading toggle bit status, it must read Q7-Q0 at least twice in a row to determine whether a toggle bit is toggling. Typically, the system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has completed the program or erase operation. The system can read array data on Q7-Q0 on the following read cycle. However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also should note whether the value of Q5 is high (see the section on Q5). If it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as Q5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. If it is still toggling, the device did not complete the operation successfully, and the system must write the reset command to return to reading array data. The remaining scenario is that system initially determines that the toggle bit is toggling and Q5 has not gone high. The system may continue to monitor the toggle bit and Q5 through successive read cycles, determining the status as described in the previous paragraph. Alternatively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation. Q2:Toggle Bit II The "Toggle Bit II" on Q2, when used with Q6, indicates whether a particular sector is actively erasing (that is, the Automatic Erase algorithm is in process), or whether that sector is erase-suspended. Toggle Bit II is valid after the rising edge of the final WE# or CE#, whichever happens first, in the command sequence. Q2 toggles when the system reads at addresses within those sectors that have been selected for erasure. (The system may use either OE# or CE# to control the read cycles.) But Q2 cannot distinguish whether the sector Q5 Exceeded Timing Limits Q5 will indicate if the program or erase time has exceeded the specified limits (internal pulse count). Under these conditions Q5 will produce a "1". This time-out condition indicates that the program or erase cycle was not successfully completed. Data# Polling and Toggle Bit are P/N:PM1183 REV. 1.4, APR. 24, 2006 18 MX29LV800C T/B the only operating functions of the device under this condition. If this time-out condition occurs during sector erase operation, it specifies that a particular sector is bad and it may not be reused. However, other sectors are still functional and may be used for the program or erase operation. The device must be reset to use other sectors. Write the Reset command sequence to the device, and then execute program or erase command sequence. This allows the system to continue to use the other active sectors in the device. If this time-out condition occurs during the chip erase operation, it specifies that the entire chip is bad or combination of sectors are bad. If this time-out condition occurs during the byte programming operation, it specifies that the entire sector containing that byte is bad and this sector may not be reused, (other sectors are still functional and can be reused). The time-out condition will not appear if a user tries to program a non blank location without erasing. Please note that this is not a device failure condition since the device was incorrectly used. TABLE 8. WRITE OPERATION STATUS Status Byte Program in Auto Program Algorithm Auto Erase Algorithm Erase Suspend Read (Erase Suspended Sector) In Progress Erase Suspended Mode Erase Suspend Read (Non-Erase Suspended Sector) Erase Suspend Program Byte Program in Auto Program Algorithm Exceeded Time Limits Auto Erase Algorithm Erase Suspend Program Data Q7# Q7# 0 Q7# Data Toggle Toggle Toggle Toggle Data Data Data 0 1 1 1 N/A N/A 1 N/A N/A No Toggle Toggle N/A 1 0 0 0 0 Q7 (Note1) Q7# 0 1 Q6 Toggle Toggle No Toggle Q5 Q3 (Note2) 0 0 0 N/A 1 Q2 RY/BY# No Toggle Toggle 0 0 1 N/A Toggle Note: 1. Q7 and Q2 require a valid address when reading status information. Refer to the appropriate subsection for further details. 2. Q5 switches to '1' when an Auto Program or Auto Erase operation has exceeded the maximum timing limits. See "Q5:Exceeded Timing Limits " for more information. P/N:PM1183 REV. 1.4, APR. 24, 2006 19 MX29LV800C T/B Q3 Sector Erase Timer After the completion of the initial sector erase command sequence, the sector erase time-out will begin. Q3 will remain low until the time-out is complete. DATA# polling and Toggle Bit are valid after the initial sector erase command sequence. If DATA# polling or the Toggle Bit indicates the device has been written with a valid erase command, Q3 may be used to determine if the sector erase timer window is still open. If Q3 is high ("1") the internally controlled erase cycle has begun; attempts to write subsequent commands to the device will be ignored until the erase operation is completed as indicated by DATA# polling or Toggle Bit. If Q3 is low ("0"), the device will accept additional sector erase commands. To insure the command has been accepted, the system software should check the status of Q3 prior to and following each subsequent sector erase command. If Q3 were high on the second status check, the command may not have been accepted. WRITE PULSE "GLITCH" PROTECTION Noise pulses of less than 5ns(typical) on CE# or WE# will not initiate a write cycle. LOGICAL INHIBIT Writing is inhibited by holding any one of OE# = VIL, CE# = VIH or WE# = VIH. To initiate a write cycle CE# and WE# must be a logical zero while OE# is a logical one. POWER SUPPLY DECOUPLING In order to reduce power switching effect, each device should have a 0.1uF ceramic capacitor connected between its VCC and GND. POWER-UP SEQUENCE The MX29LV800C T/B powers up in the Read only mode. In addition, the memory contents may only be altered after successful completion of the predefined command sequences. DATA PROTECTION The MX29LV800C T/B is designed to offer protection against accidental erasure or programming caused by spurious system level signals that may exist during power transition. During power up the device automatically resets the state machine in the Read mode. In addition, with its control register architecture, alteration of the memory contents only occurs after successful completion of specific command sequences. The device also incorporates several features to prevent inadvertent write cycles resulting from VCC power-up and power-down transition or system noise. TEMPORARY SECTOR UNPROTECTED This feature allows temporary unprotected of previously protected sector to change data in-system. The Temporary Sector Unprotected mode is activated by setting the RESET# pin to VID(11.5V-12.5V). During this mode, formerly protected sectors can be programmed or erased as un-protected sector. Once VID is remove from the RESET# pin, all the previously protected sectors are protected again. LOW VCC WRITE INHIBIT SECTOR PROTECTION When VCC is less than VLKO the device does not accept any write cycles. This protects data during VCC power-up and power-down. The command register and all internal program/erase circuits are disabled, and the device resets. Subsequent writes are ignored until VCC is greater than VLKO. The system must provide the proper signals to the control pins to prevent unintentional write when VCC is greater than VLKO. The MX29LV800C T/B features hardware sector protection. This feature will disable both program and erase operations for these sectors protected. To activate this mode, the programming equipment must force VID on address pin A9 and OE# (suggest VID = 12V). Programming of the protection circuitry begins on the falling edge of the WE# pulse and is terminated on the rising edge. Please refer to sector protect algorithm and wave- P/N:PM1183 REV. 1.4, APR. 24, 2006 20 MX29LV800C T/B form. To verify programming of the protection circuitry, the programming equipment must force VID on address pin A9 ( with CE# and OE# at VIL and WE# at VIH). When A1=VIH, A0=VIL, A6=VIL, it will produce a logical "1" code at device output Q0 for a protected sector. Otherwise the device will produce 00H for the unprotected sector. In this mode, the addresses, except for A1, are don't care. Address locations with A1 = VIL are reserved to read manufacturer and device codes. (Read Silicon ID) It is also possible to determine if the sector is protected in the system by writing a Read Silicon ID command. Performing a read operation with A1=VIH, it will produce a logical "1" at Q0 for the protected sector. CHIP UNPROTECTED The MX29LV800C T/B also features the chip unprotected mode, so that all sectors are unprotected after chip unprotected is completed to incorporate any changes in the code. It is recommended to protect all sectors before activating chip unprotected mode. To activate this mode, the programming equipment must force VID on control pin OE# and address pin A9. The CE# pins must be set at VIL. Pins A6 must be set to VIH. Refer to chip unprotected algorithm and waveform for the chip unprotected algorithm. The unprotection mechanism begins on the falling edge of the WE# pulse and is terminated on the rising edge. It is also possible to determine if the chip is unprotected in the system by writing the Read Silicon ID command. Performing a read operation with A1=VIH, it will produce 00H at data outputs (Q0-Q7) for an unprotected sector. It is noted that all sectors are unprotected after the chip unprotected algorithm is completed. P/N:PM1183 REV. 1.4, APR. 24, 2006 21 MX29LV800C T/B ABSOLUTE MAXIMUM RATINGS Storage Temperature Plastic Packages . . . . . . . . . . . . . ..... -65oC to +150oC Ambient Temperature with Power Applied. . . . . . . . . . . . . .... -65oC to +125oC Voltage with Respect to Ground VCC (Note 1) . . . . . . . . . . . . . . . . . -0.5 V to +4.0 V A9, OE#, and RESET# (Note 2) . . . . . . . . . . . ....-0.5 V to +12.5 V All other pins (Note 1) . . . . . . . -0.5 V to VCC +0.5 V Output Short Circuit Current (Note 3) . . . . . . 200 mA Notes: 1. Minimum DC voltage on input or I/O pins is -0.5 V. During voltage transitions, input or I/O pins may overshoot VSS to -2.0 V for periods of up to 20 ns. See Figure 6. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During voltage transitions, input or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns. 2. Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During voltage transitions, A9, OE#, and RESET# may overshoot VSS to -2.0 V for periods of up to 20 ns. See Figure 6. Maximum DC input voltage on pin A9 is +12.5 V which may overshoot to 14.0 V for periods up to 20 ns. 3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second. Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. OPERATING RATINGS Commercial (C) Devices Ambient Temperature (TA ). . . . . . . . . . . . 0C to +70C Industrial (I) Devices Ambient Temperature (TA ). . . . . . . . . . -40C to +85C VCC Supply Voltages VCC for regulated voltage range. . . . . . +3.0 V to 3.6 V VCC for full voltage range. . . . . . . . . . . +2.7 V to 3.6 V Operating ranges define those limits between which the functionality of the device is guaranteed. P/N:PM1183 REV. 1.4, APR. 24, 2006 22 MX29LV800C T/B CAPACITANCE TA = 25oC, f = 1.0 MHz SYMBOL CIN1 CIN2 COUT PARAMETER Input Capacitance Control Pin Capacitance Output Capacitance MIN. TYP MAX. 8 12 12 UNIT pF pF pF CONDITIONS VIN = 0V VIN = 0V VOUT = 0V TABLE 9. DC CHARACTERISTICS TA = -40oC to 85oC, VCC = 2.7V~3.6V Symbol ILI ILIT ILO ICC1 PARAMETER Input Leakage Current A9 Input Leakage Current Output Leakage Current VCC Active Read Current 7 2 7 2 ICC2 ICC3 ICC4 VCC Active write Current VCC Standby Current VCC Standby Current During Reset ICC5 VIL VIH VID Automatic sleep mode Input Low Voltage(Note 1) Input High Voltage Voltage for Automatic Select and Temporary Sector Unprotected VOL VOH1 VOH2 Output Low Voltage Output High Voltage(TTL) Output High Voltage (CMOS) VLKO Low VCC Lock-Out Voltage (Note 4) 1.4 2.1 V 0.85xVCC VCC-0.4 0.45 V IOL = 4.0mA, VCC= VCC min IOH = -2mA, VCC=VCC min IOH = -100uA, VCC min 11.5 12.5 V VCC=3.3V -0.5 0.7xVCC 0.2 5 0.8 VCC+ 0.3 uA V V VIH=VCC 0.3V; VIL=VSS 0.3V 15 0.2 0.2 MIN. TYP MAX. 1 35 1 12 4 12 4 30 5 5 UNIT uA uA uA mA mA mA mA mA uA uA CONDITIONS VIN = VSS to VCC VCC=VCC max; A9=12.5V VOUT = VSS to VCC, VCC=VCC max CE#=VIL, OE#=VIH @5MHz (Byte Mode) @1MHz CE#=VIL, OE#=VIH @5MHz (Word Mode) CE#=VIL, OE#=VIH CE#; RESET#=VCC 0.3V RESET#=VSS 0.3V @1MHz NOTES: 1. VIL min. = -1.0V for pulse width is equal to or less than 50 ns. VIL min. = -2.0V for pulse width is equal to or less than 20 ns. 2. VIH max. = VCC + 1.5V for pulse width is equal to or less than 20 ns If VIH is over the specified maximum value, read operation cannot be guaranteed. 3. Automatic sleep mode enable the low power mode when addresses remain stable for tACC +30ns. 4. Not 100% tested. P/N:PM1183 REV. 1.4, APR. 24, 2006 23 MX29LV800C T/B AC CHARACTERISTICS TA = -40oC to 85oC, VCC = 2.7V~3.6V (Restricted VCC=3.0V~3.6V for 45R/55R) TABLE 10. READ OPERATIONS Parameter Std. tRC tACC tCE tOE tDF tOEH Description Read Cycle Time (Note 1) Address to Output Delay CE# to Output Delay OE# to Output Delay OE# High to Output Float (Note1) Output Enable Hold Time tOH Read Toggle and Data# Polling Test Setup MIN. CE#=OE#=VIL MAX. OE#=VIL CE#=VIL CE#=VIL MAX. MAX. MAX. MIN. MIN. CE#=OE#=VIL MIN. Speed Options 45R 45 45 45 30 25 0 10 0 55R 55 55 55 30 25 0 10 0 70 70 70 70 30 25 0 10 0 90 90 90 90 35 30 0 10 0 Unit ns ns ns ns ns ns ns ns Address to Output hold TEST CONDITIONS: * Input pulse levels: 0V/3.0V. * Input rise and fall times is equal to or less than 5ns. * Output load: 1 TTL gate + 100pF (Including scope and jig), for 29LV800C T/B-90. 1 TTL gate + 30pF (Including scope and jig) for 29LV800C T/B-70 * Reference levels for measuring timing: 1.5V. NOTES: 1. Not 100% tested. 2. tDF is defined as the time at which the output achieves the open circuit condition and data is no longer driven. P/N:PM1183 REV. 1.4, APR. 24, 2006 24 MX29LV800C T/B SWITCHING TEST CIRCUITS DEVICE UNDER TEST 2.7K ohm +3.3V CL 6.2K ohm DIODES=IN3064 OR EQUIVALENT CL= 100pF Including jig capacitance (30pF for MX29LV800CT/CB-70) SWITCHING TEST WAVEFORMS 3.0V TEST POINTS 0V INPUT OUTPUT AC TESTING: Inputs are driven at 3.0V for a logic "1" and 0V for a logic "0". Input pulse rise and fall times are < 5ns. P/N:PM1183 REV. 1.4, APR. 24, 2006 25 MX29LV800C T/B FIGURE 1. READ TIMING WAVEFORMS tRC VIH Addresses VIL ADD Valid tACC tCE CE# VIH VIL WE# VIH VIL tOEH VIH tOE tDF OE# VIL tACC tOH Outputs VOH VOL HIGH Z DATA Valid HIGH Z VIH RESET# VIL P/N:PM1183 REV. 1.4, APR. 24, 2006 26 MX29LV800C T/B AC CHARACTERISTICS TA = -40oC to 85oC, VCC = 2.7V~3.6V (Restricted VCC=3.0V~3.6V for 45R/55R) TABLE 11. Erase/Program Operations Parameter Std. tWC tAS tAH tDS tDH tOES tGHWL tCS tCH tWP tWPH tWHWH1 tWHWH2 tVCS tRB tBUSY tWPP1 tWPP2 tBAL NOTES: Speed Options 45R MIN. MIN. MIN. MIN. MIN. MIN. MIN. MIN. MIN. MIN. MIN. BYTE WORD TYP. TYP. TYP. MIN. MIN. MAX. MIN. TYP. MIN. TYP. MAX. 45 0 45 35 0 0 0 0 0 35 30 9 11 0.7 50 0 90 100 10 100 12 50 55R 55 0 45 35 0 0 0 0 0 35 30 9 11 0.7 50 0 90 100 10 100 12 50 70 70 0 45 35 0 0 0 0 0 35 30 9 11 0.7 50 0 90 100 10 100 12 50 90 90 0 45 45 0 0 0 0 0 35 30 9 11 0.7 50 0 90 100 10 100 12 50 Unit ns ns ns ns ns ns ns ns ns ns ns us us sec us ns ns ns us ns ms us Description Write Cycle Time (Note 1) Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recovery Time Before Write (OE# High to WE# Low) CE# Setup Time CE# Hold Time Write Pulse Width Write Pulse Width High Programming Operation (Note 2) (Byte/Word program time) Sector Erase Operation (Note 2) VCC Setup Time (Note 1) Recovery Time from RY/BY# Program/Erase Valid to RY/BY# Delay Write Pulse Width for Sector Protect (A9, OE# Control) Write Pulse Width for Chip Unprotected (A9, OE# Control) Sector Address Load Time 1. Not 100% tested. 2. See the "Erase and Programming Performance" section for more information. P/N:PM1183 REV. 1.4, APR. 24, 2006 27 MX29LV800C T/B AC CHARACTERISTICS TA = -40oC to 85oC, VCC = 2.7V~3.6V (Restricted VCC=3.0V~3.6V for 45R/55R) TABLE 12. Alternate CE# Controlled Erase/Program Operations Parameter Std. tWC tCWC tAS tAH tDS tDH tOES tGHEL tWS tWH tCP tCPH tWHWH1 tWHWH2 NOTE: Speed Options Description Write Cycle Time (Note 1) Command Write Cycle Time Address Setup Time Address Hold Time Data Setup Time Data Hold Time Output Enable Setup Time Read Recovery Time Before Write WE# Setup Time WE# Hold Time CE# Pulse Width CE# Pulse Width High Programming Operation(note2) Sector Erase Operation (note2) Byte Word MIN. MIN. MIN. MIN. MIN. MIN. MIN. MIN. MIN. MIN. MIN. MIN. TYP. TYP. TYP. 45R 45 45 0 45 35 0 0 0 0 0 35 30 9 11 0.7 55R 55 55 0 45 35 0 0 0 0 0 35 30 9 11 0.7 70 70 70 0 45 35 0 0 0 0 0 35 30 9 11 0.7 90 90 90 0 45 45 0 0 0 0 0 35 30 9 11 0.7 Unit ns ns ns ns ns ns ns ns ns ns ns ns us us sec 1. Not 100% tested. 2. See the "Erase and Programming Performance" section for more information. P/N:PM1183 REV. 1.4, APR. 24, 2006 28 MX29LV800C T/B FIGURE 2. COMMAND WRITE TIMING WAVEFORM VCC 3V Addresses VIH ADD Valid VIL tAS tAH WE# VIH VIL tOES tWP tCWC tWPH CE# VIH VIL tCS tCH OE# VIH VIL VIH tDS tDH Data VIL DIN P/N:PM1183 REV. 1.4, APR. 24, 2006 29 MX29LV800C T/B AUTOMATIC PROGRAMMING TIMING WAVEFORM One byte data is programmed. Verify in fast algorithm and additional verification by external control are not required because these operations are executed automatically by internal control circuit. Programming completion can be verified by DATA# polling and toggle bit checking after automatic programming starts. Device outputs DATA# during programming and DATA# after programming on Q7. (Q6 is for toggle bit; see toggle bit, DATA# polling, timing waveform) FIGURE 3. AUTOMATIC PROGRAMMING TIMING WAVEFORM Program Command Sequence(last two cycle) tWC tAS Read Status Data (last two cycle) Address 555h PA tAH PA PA CE# tCH tGHWL OE# tWP tWHWH1 WE# tCS tDS tDH tWPH A0h Data PD Status DOUT tBUSY tRB RY/BY# tVCS VCC NOTES: 1.PA=Program Address, PD=Program Data, DOUT is the true data the program address P/N:PM1183 REV. 1.4, APR. 24, 2006 30 MX29LV800C T/B FIGURE 4. AUTOMATIC PROGRAMMING ALGORITHM FLOWCHART START Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data A0H Address 555H Write Program Data/Address Increment Address Data Poll from system No Verify Word Ok ? YES No Last Address ? YES Auto Program Completed P/N:PM1183 REV. 1.4, APR. 24, 2006 31 MX29LV800C T/B FIGURE 5. CE# CONTROLLED PROGRAM TIMING WAVEFORM 555 for program 2AA for erase PA for program SA for sector erase 555 for chip erase Data Polling Address tWC tWH tAS tAH PA WE# tGHEL OE# tCP tWHWH1 or 2 CE# tWS tDS tDH tCPH tBUSY DQ7 DOUT Data tRH A0 for program 55 for erase PD for program 30 for sector erase 10 for chip erase RESET# RY/BY# NOTES: 1.PA=Program Address, PD=Program Data, DOUT=Data Out, DQ7=complement of data written to device. 2.Figure indicates the last two bus cycles of the command sequence. P/N:PM1183 REV. 1.4, APR. 24, 2006 32 MX29LV800C T/B AUTOMATIC CHIP ERASE TIMING WAVEFORM All data in chip are erased. External erase verification is not required because data is verified automatically by internal control circuit. Erasure completion can be verified by DATA# polling and toggle bit checking after automatic erase starts. Device outputs 0 during erasure and 1 after erasure on Q7. (Q6 is for toggle bit; see toggle bit, DATA# polling, timing waveform) FIGURE 6. AUTOMATIC CHIP ERASE TIMING WAVEFORM Erase Command Sequence(last two cycle) tWC tAS Read Status Data Address 2AAh 555h tAH VA VA CE# tCH tGHWL OE# tWP tWHWH2 WE# tCS tDS tDH tWPH 55h Data 10h In Progress Complete tBUSY tRB RY/BY# tVCS VCC NOTES: SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status"). P/N:PM1183 REV. 1.4, APR. 24, 2006 33 MX29LV800C T/B FIGURE 7. AUTOMATIC CHIP ERASE ALGORITHM FLOWCHART START Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data 80H Address 555H Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data 10H Address 555H Data Pall from System NO Data=FFh ? YES Auto Chip Erase Completed P/N:PM1183 REV. 1.4, APR. 24, 2006 34 MX29LV800C T/B AUTOMATIC SECTOR ERASE TIMING WAVEFORM Sector indicated by A12 to A18 are erased. External erase verify is not required because data are verified automatically by internal control circuit. Erasure completion can be verified by DATA# polling and toggle bit checking after automatic erase starts. Device outputs 0 during erasure and 1 after erasure on Q7. (Q6 is for toggle bit; see toggle bit, DATA# polling, timing waveform) FIGURE 8. AUTOMATIC SECTOR ERASE TIMING WAVEFORM Erase Command Sequence(last two cycle) tWC tAS Read Status Data Address 2AAh Sector Address 0 tAH Sector Address 1 Sector Address n VA VA CE# tCH tGHWL OE# tBAL tWHWH2 tWP WE# tCS tDS tDH tWPH 55h Data 30h 30h 30h In Progress Complete tBUSY tRB RY/BY# tVCS VCC NOTES: SA=sector address(for Sector Erase), VA=Valid Address for reading status data(see "Write Operation Status"). P/N:PM1183 REV. 1.4, APR. 24, 2006 35 MX29LV800C T/B FIGURE 9. AUTOMATIC SECTOR ERASE ALGORITHM FLOWCHART START Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data 80H Address 555H Write Data AAH Address 555H Write Data 55H Address 2AAH Write Data 30H Sector Address Last Sector to Erase YES Data Poll from System NO Data=FFh NO YES Auto Sector Erase Completed P/N:PM1183 REV. 1.4, APR. 24, 2006 36 MX29LV800C T/B FIGURE 10. ERASE SUSPEND/ERASE RESUME FLOWCHART START Write Data B0H ERASE SUSPEND Toggle Bit checking Q6 not toggled YES Read Array or Program NO Reading or Programming End YES Write Data 30H NO Delay at least 400us (note) ERASE RESUME Continue Erase Another Erase Suspend ? YES NO Note: Repeatedly suspending the device more often may have undetermined effects. P/N:PM1183 REV. 1.4, APR. 24, 2006 37 MX29LV800C T/B FIGURE 11. IN-SYSTEM SECTOR PROTECT/UNPROTECTED TIMING WAVEFORM (RESET# Control) VID VIH RESET# SA, A6 A1, A0 Valid* Valid* Valid* Sector Protect or Chip Unprotect Data 1us Verify 40h Status 60h 60h Sector Protect =150us Chip Unprotect =15ms CE# WE# OE# Note: When sector protect, A6=0, A1=1, A0=0. When chip unprotect, A6=1, A1=1, A0=0. P/N:PM1183 REV. 1.4, APR. 24, 2006 38 MX29LV800C T/B FIGURE 12. SECTOR PROTECT TIMING WAVEFORM (A9, OE# Control) A1 A6 12V 3V A9 tVLHT Verify 12V 3V OE# tVLHT tWPP 1 tVLHT WE# tOESP CE# Data tOE 01H F0H A18-A12 Sector Address P/N:PM1183 REV. 1.4, APR. 24, 2006 39 MX29LV800C T/B FIGURE 13. SECTOR PROTECTION ALGORITHM (A9, OE# Control) START Set Up Sector Addr PLSCNT=1 OE#=VID, A9=VID, CE#=VIL A6=VIL Activate WE# Pulse Time Out 150us Set WE#=VIH, CE#=OE#=VIL A9 should remain VID . No Read from Sector Addr=SA, A1=1 PLSCNT=32? No Data=01H? Yes Device Failed Protect Another Sector? Yes Remove VID from A9 Write Reset Command Sector Protection Complete P/N:PM1183 REV. 1.4, APR. 24, 2006 40 MX29LV800C T/B FIGURE 14. IN-SYSTEM SECTOR PROTECTION ALGORITHM WITH RESET#=VID START PLSCNT=1 RESET#=VID Wait 1us First Write Cycle=60H Yes Set up sector address No Temporary Sector Unprotect Mode Write 60H to sector address with A6=0, A1=1, A0=0 Wait 150us Increment PLSCNT Verify sector protect : write 40H with A6=0, A1=1, A0=0 Reset PLSCNT=1 Read from sector address No No Data=01H ? PLSCNT=25? Yes Device failed Yes Protect another sector? No Remove VID from RESET# Yes Write reset command Sector protect complete P/N:PM1183 REV. 1.4, APR. 24, 2006 41 MX29LV800C T/B FIGURE 15. IN-SYSTEM CHIP UNPROTECTION ALGORITHM WITH RESET#=VID START PLSCNT=1 RESET#=VID Wait 1us First Write Cycle=60H ? Yes No Temporary Sector Unprotect Mode All sector protected? Yes Set up first sector address No Protect all sectors Chip unprotect : write 60H with A6=1, A1=1, A0=0 Wait 50ms Increment PLSCNT Verify chip unprotect write 40H to sector address with A6=1, A1=1, A0=0 Read from sector address with A6=1, A1=1, A0=0 No No Data=00H ? PLSCNT=1000? Set up next sector address Yes Device failed Yes Last sector verified? No Remove VID from RESET# Yes Write reset command Chip unprotect complete P/N:PM1183 REV. 1.4, APR. 24, 2006 42 MX29LV800C T/B FIGURE 16. TIMING WAVEFORM FOR CHIP UNPROTECTION (A9, OE# Control) A1 12V Vcc 3V A9 tVLHT A6 Verify 12V Vcc 3V OE# tVLHT tWPP 2 time out 50ms tVLHT WE# tOESP CE# Data tOE 00H F0H A18-A12 Sector Address Notes: tVLHT (Voltage transition time)=4us min. tWPP1 (Write pulse width for sector protect)=100ns min, 10us(Typ.) tWPP2 (Write pulse width for chip unprotected)=100ns min, 12ms(Typ.) tOESP (OE# setup time to WE# active)=4us min. P/N:PM1183 REV. 1.4, APR. 24, 2006 43 MX29LV800C T/B FIGURE 17. CHIP UNPROTECTION ALGORITHM (A9, OE# Control) START Protect All Sectors PLSCNT=1 Set OE#=A9=VID CE#=VIL,A6=1 Activate WE# Pulse Time Out 50ms Increment PLSCNT Set OE#=CE#=VIL A9=VID,A1=1 Set Up First Sector Addr Read Data from Device No Increment Sector Addr Data=00H? No PLSCNT=1000? Yes No Yes Device Failed All sectors have been verified? Yes Remove VID from A9 Write Reset Command Chip Unprotect Complete * It is recommended before unprotect whole chip, all sectors should be protected in advance. P/N:PM1183 REV. 1.4, APR. 24, 2006 44 MX29LV800C T/B WRITE OPERATION STATUS FIGURE 18. DATA# POLLING ALGORITHM Start Read Q7~Q0 Add.=VA(1) Q7 = Data ? Yes No No Q5 = 1 ? Yes Read Q7~Q0 Add.=VA Q7 = Data ? (2) No FAIL Yes Pass NOTE : 1.VA=Valid address for programming 2.Q7 should be re-checked even Q5="1" because Q7 may change simultaneously with Q5. P/N:PM1183 REV. 1.4, APR. 24, 2006 45 MX29LV800C T/B FIGURE 19. TOGGLE BIT ALGORITHM Start Read Q7-Q0 Read Q7-Q0 (Note 1) Toggle Bit Q6 = Toggle ? NO YES NO Q5= 1? YES Read Q7~Q0 Twice (Note 1,2) Toggle bit Q6= Toggle? NO YES Program/Erase Operation Not Complete,Write Reset Command Program/Erase operation Complete Note:1.Read toggle bit twice to determine whether or not it is toggling. 2. Recheck toggle bit because it may stop toggling as Q5 change to "1". P/N:PM1183 REV. 1.4, APR. 24, 2006 46 MX29LV800C T/B FIGURE 20. DATA# Polling Timings (During Automatic Algorithms) tRC Address VA tACC tCE VA VA CE# tCH tOE OE# tOEH tDF WE# tOH DQ7 Q0-Q6 tBUSY Complement Complement True Valid Data High Z Status Data Status Data True Valid Data High Z RY/BY# NOTES: 1. VA=Valid address. Figure shows are first status cycle after command sequence, last status read cycle, and array data read cycle. 2. CE# must be toggled when DATA# polling. P/N:PM1183 REV. 1.4, APR. 24, 2006 47 MX29LV800C T/B FIGURE 21. Toggle Bit Timings (During Automatic Algorithms) tRC Address VA tACC tCE VA VA VA CE# tCH tOE OE# tOEH tDF WE# tOH Q6/Q2 High Z Valid Status (first read) Valid Status (second read) Valid Data (stops toggling) Valid Data tBUSY RY/BY# NOTES: 1. VA=Valid address; not required for Q6. Figure shows first two status cycle after command sequence, last status read cycle, and array data read cycle. 2. CE# must be toggled when toggle bit toggling. P/N:PM1183 REV. 1.4, APR. 24, 2006 48 MX29LV800C T/B TABLE 13. AC CHARACTERISTICS Parameter Std tREADY1 Description RESET# PIN Low (During Automatic Algorithms) to Read or Write (See Note) tREADY2 RESET# PIN Low (NOT During Automatic Algorithms) to Read or Write (See Note) tRP tRH tRB RESET# Pulse Width (During Automatic Algorithms) RESET# High Time Before Read (See Note) RY/BY# Recovery Time (to CE#, OE# go low) MIN MIN MIN 500 50 0 ns ns ns MAX 500 ns Test Setup All Speed Options Unit MAX 20 us Note: Not 100% tested FIGURE 22. RESET# TIMING WAVEFORM RY/BY# CE#, OE# tRH RESET# tRP tREADY2 Reset Timing NOT during Automatic Algorithms tREADY1 RY/BY# tRB CE#, OE# RESET# tRP Reset Timing during Automatic Algorithms P/N:PM1183 REV. 1.4, APR. 24, 2006 49 MX29LV800C T/B AC CHARACTERISTICS TABLE 14. WORD/BYTE CONFIGURATION (BYTE#) Parameter JEDEC Std tELFL/tELFH tFLQZ tFHQV CE# to BYTE# Switching Low or High BYTE# Switching Low to Output HIGH Z BYTE# Switching High to Output Active Max Max Min 25 45 25 55 Description Speed Options -45R -55R 5 25 70 30 90 -70 -90 ns ns ns Unit FIGURE 23. BYTE# TIMING WAVEFORM FOR READ OPERATIONS (BYTE# switching from byte mode to word mode) CE# OE# tELFH BYTE# Q0~Q14 DOUT (Q0-Q7) DOUT (Q0-Q14) Q15/A-1 VA tFHQV DOUT (Q15) P/N:PM1183 REV. 1.4, APR. 24, 2006 50 MX29LV800C T/B FIGURE 24. BYTE# TIMING WAVEFORM FOR READ OPERATIONS (BYTE# switching from word mode to byte mode) CE# OE# tELFH BYTE# Q0~Q14 DOUT (Q0-Q14) DOUT (Q0-Q7) Q15/A-1 DOUT (Q15) tFLQZ VA FIGURE 25. BYTE# TIMING WAVEFORM FOR PROGRAM OPERATIONS CE# The falling edge of the last WE# signal WE# BYTE# tAS tAH P/N:PM1183 REV. 1.4, APR. 24, 2006 51 MX29LV800C T/B TABLE 15. TEMPORARY SECTOR UNPROTECTED Parameter Std. Description tVIDR tRSP Note: Not 100% tested VID Rise and Fall Time (See Note) RESET# Setup Time for Temporary Sector Unprotected Test Setup All Speed Options Unit Min Min 500 4 ns us FIGURE 26. TEMPORARY SECTOR UNPROTECTED TIMING DIAGRAM 12V RESET# 0 or Vcc Program or Erase Command Sequence 0 or Vcc tVIDR tVIDR CE# WE# tRSP RY/BY# FIGURE 27. Q6 vs Q2 for Erase and Erase Suspend Operations Enter Embedded Erasing Erase Suspend Erase Enter Erase Suspend Program Erase Suspend Program Erase Suspend Read Erase Resume Erase Erase Complete WE# Q6 Q2 NOTES: The system can use OE or CE to toggle Q2/Q6, Q2 toggles only when read at an address within an erase-suspended P/N:PM1183 REV. 1.4, APR. 24, 2006 52 MX29LV800C T/B FIGURE 28. TEMPORARY SECTOR UNPROTECTED ALGORITHM Start RESET# = VID (Note 1) Perform Erase or Program Operation Operation Completed RESET# = VIH Temporary Sector Unprotect Completed(Note 2) Note : 1. All protected sectors are temporary unprotected. VID=11.5V~12.5V 2. All previously protected sectors are protected again. P/N:PM1183 REV. 1.4, APR. 24, 2006 53 MX29LV800C T/B FIGURE 29. ID CODE READ TIMING WAVEFORM VCC 3V VID VIH VIL VIH VIL tACC VIH tACC ADD A9 ADD A0 A1 VIL ADD A2-A8 A10-A18 CE# VIH VIL VIH VIL WE# VIH VIL tCE OE# VIH VIL tOE tDF tOH tOH VIH DATA Q0-Q15 DATA OUT VIL DATA OUT DAH/5BH (Byte) 22DAH/225BH (Word) C2H/00C2H P/N:PM1183 REV. 1.4, APR. 24, 2006 54 MX29LV800C T/B RECOMMENDED OPERATING CONDITIONS At Device Power-Up AC timing illustrated in Figure A is recommended for the supply voltages and the control signals at device power-up. If the timing in the figure is ignored, the device may not operate correctly. VCC(min) VCC GND tVR tR or tF tACC tR or tF VIH ADDRESS VIL Valid Address tF tCE tR VIH CE# VIL VIH WE# VIL tF VIH tOE tR OE# VIL VIH WP#/ACC VIL VOH DATA High Z VOL Valid Ouput Figure A. AC Timing at Device Power-Up Symbol tVR tR tF Parameter VCC Rise Time Input Signal Rise Time Input Signal Fall Time Notes 1 1,2 1,2 Min. 20 Max. 500000 20 20 Unit us/V us/V us/V Notes : 1. Sampled, not 100% tested. 2. This specification is applied for not only the device power-up but also the normal operations. P/N:PM1183 REV. 1.4, APR. 24, 2006 55 MX29LV800C T/B ERASE AND PROGRAMMING PERFORMANCE (1) PARAMETER Sector Erase Time Chip Erase Time Byte Programming Time Word Programming Time Chip Programming Time Byte Mode Word Mode Erase/Program Cycles 100,000 MIN. LIMITS TYP.(2) 0.7 14 9 11 9 5.8 MAX.(3) 15 UNITS sec sec 300 360 27 17 us us sec sec Cycles Note: 1. Not 100% Tested, Excludes external system level over head. 2. Typical values measured at 25C, 3V. 3. Maximum values measured at 25C, 2.7V. LATCH-UP CHARACTERISTICS MIN. Input Voltage with respect to GND on OE#, RESET#, A9 Input Voltage with respect to GND on all power pins, Address pins, CE# and WE# Input Voltage with respect to GND on all I/O pins Current Includes all pins except VCC. Test conditions: VCC = 3.0V, one pin at a time. -1.0V -1.0V -1.0V -100mA MAX. 12.5V VCC + 1.0V VCC + 1.0V +100mA P/N:PM1183 REV. 1.4, APR. 24, 2006 56 MX29LV800C T/B ORDERING INFORMATION PART NO. ACCESS TIME (ns) MX29LV800CTMC-55R 55 MX29LV800CBMC-55R 55 MX29LV800CTMC-70 70 MX29LV800CBMC-70 70 MX29LV800CTMC-90 90 MX29LV800CBMC-90 90 MX29LV800CTTC-55R 55 MX29LV800CBTC-55R MX29LV800CTTC-70 MX29LV800CBTC-70 MX29LV800CTTC-90 MX29LV800CBTC-90 MX29LV800CTXBC-55R MX29LV800CBXBC-55R MX29LV800CTXBC-70 MX29LV800CBXBC-70 MX29LV800CTXBC-90 MX29LV800CBXBC-90 MX29LV800CTMI-55R MX29LV800CBMI-55R MX29LV800CTMI-70 MX29LV800CBMI-70 MX29LV800CTMI-90 MX29LV800CBMI-90 MX29LV800CTTI-55R MX29LV800CBTI-55R MX29LV800CTTI-70 MX29LV800CBTI-70 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 OPERATING Current MAX. (mA) 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY Current MAX. (uA) 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 PACKAGE 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) REV. 1.4, APR. 24, 2006 Remark P/N:PM1183 57 MX29LV800C T/B PART NO. MX29LV800CTTI-90 MX29LV800CBTI-90 MX29LV800CTXBI-55R MX29LV800CBXBI-55R MX29LV800CTXBI-70 MX29LV800CBXBI-70 MX29LV800CTXBI-90 MX29LV800CBXBI-90 MX29LV800CTXEC-55R MX29LV800CBXEC-55R MX29LV800CTXEC-70 MX29LV800CBXEC-70 MX29LV800CTXEC-90 MX29LV800CBXEC-90 MX29LV800CTXEI-55R MX29LV800CBXEI-55R MX29LV800CTXEI-70 MX29LV800CBXEI-70 MX29LV800CTXEI-90 MX29LV800CBXEI-90 MX29LV800CTMC-55Q MX29LV800CBMC-55Q MX29LV800CTMC-70G MX29LV800CBMC-70G ACCESS TIME (ns) 90 90 55 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 OPERATING Current MAX. (mA) 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY Current MAX. (uA) 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 PACKAGE 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP Remark PB free PB free PB free PB free P/N:PM1183 REV. 1.4, APR. 24, 2006 58 MX29LV800C T/B PART NO. ACCESS TIME (ns) MX29LV800CTMC-90G 90 MX29LV800CBMC-90G 90 MX29LV800CTTC-55Q 55 MX29LV800CBTC-55Q MX29LV800CTTC-70G MX29LV800CBTC-70G MX29LV800CTTC-90G MX29LV800CBTC-90G MX29LV800CTXBC-55Q MX29LV800CBXBC-55Q MX29LV800CTXBC-70G MX29LV800CBXBC-70G MX29LV800CTXBC-90G MX29LV800CBXBC-90G MX29LV800CTMI-55Q MX29LV800CBMI-55Q MX29LV800CTMI-70G MX29LV800CBMI-70G MX29LV800CTMI-90G MX29LV800CBMI-90G MX29LV800CTTI-55Q MX29LV800CBTI-55Q MX29LV800CTTI-70G MX29LV800CBTI-70G MX29LV800CTTI-90G MX29LV800CBTI-90G MX29LV800CTXBI-55Q 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 90 90 55 OPERATING Current MAX. (mA) 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY Current MAX. (uA) 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 PACKAGE 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 44 Pin SOP 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (Ball Size:0.3mm) Remark PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free P/N:PM1183 REV. 1.4, APR. 24, 2006 59 MX29LV800C T/B PART NO. ACCESS TIME (ns) MX29LV800CBXBI-55Q 55 MX29LV800CTXBI-70G MX29LV800CBXBI-70G MX29LV800CTXBI-90G MX29LV800CBXBI-90G MX29LV800CTXEC-55Q MX29LV800CBXEC-55Q MX29LV800CTXEC-70G MX29LV800CBXEC-70G MX29LV800CTXEC-90G MX29LV800CBXEC-90G MX29LV800CTXEI-55Q MX29LV800CBXEI-55Q MX29LV800CTXEI-70G MX29LV800CBXEI-70G MX29LV800CTXEI-90G MX29LV800CBXEI-90G MX29LV800CTTI-45Q MX29LV800CBTI-45Q MX29LV800CTXBI-45Q MX29LV800CBXBI-45Q MX29LV800CTXEI-45Q MX29LV800CBXEI-45Q 70 70 90 90 55 55 70 70 90 90 55 55 70 70 90 90 45 45 45 45 45 45 OPERATING Current MAX. (mA) 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY Current MAX. (uA) 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 PACKAGE 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) 48 Pin TSOP (Normal Type) 48 Pin TSOP (Normal Type) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.3mm) 48 Ball CSP (Ball Size:0.4mm) 48 Ball CSP (Ball Size:0.4mm) Remark PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free P/N:PM1183 REV. 1.4, APR. 24, 2006 60 MX29LV800C T/B PART NO. ACCESS TIME (ns) MX29LV800CTXHC-55R 55 MX29LV800CBXHC-55R MX29LV800CTXHC-70 MX29LV800CBXHC-70 MX29LV800CTXHC-90 MX29LV800CBXHC-90 MX29LV800CTXHI-55R MX29LV800CBXHI-55R MX29LV800CTXHI-70 MX29LV800CBXHI-70 MX29LV800CTXHI-90 MX29LV800CBXHI-90 MX29LV800CTXHC-55Q MX29LV800CBXHC-55Q MX29LV800CTXHC-70G MX29LV800CBXHC-70G MX29LV800CTXHC-90G MX29LV800CBXHC-90G MX29LV800CTXHI-55Q MX29LV800CBXHI-55Q MX29LV800CTXHI-70G MX29LV800CBXHI-70G MX29LV800CTXHI-90G MX29LV800CBXHI-90G 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 90 90 55 55 70 70 90 90 OPERATING Current MAX. (mA) 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY Current MAX. (uA) 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 PACKAGE 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) 48 Ball CSP (4 x 6 mm) Remark PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free PB free P/N:PM1183 REV. 1.4, APR. 24, 2006 61 MX29LV800C T/B PART NAME DESCRIPTION MX 29 LV 800 C T T C 70 G OPTION: G: Lead-free package R: Restricted VCC (3.0V~3.6V) Q: Restricted VCC (3.0V~3.6V) with Lead-free package blank: normal SPEED: 45: 45ns 55: 55ns 70: 70ns 90: 90ns TEMPERATURE RANGE: C: Commercial (0C to 70C) I: Industrial (-40C to 85C) PACKAGE: M: SOP T: TSOP X: FBGA (CSP) XB - 0.3mm Ball (6x8mm) XE - 0.4mm Ball (6x8mm) XH - 0.32mm Ball (4x6mm) BOOT BLOCK TYPE: T: Top Boot B: Bottom Boot REVISION: C DENSITY & MODE: 800: 8M, x8/x16 Boot Block TYPE: L, LV: 3V DEVICE: 28, 29:Flash P/N:PM1183 REV. 1.4, APR. 24, 2006 62 MX29LV800C T/B PACKAGE INFORMATION P/N:PM1183 REV. 1.4, APR. 24, 2006 63 MX29LV800C T/B P/N:PM1183 REV. 1.4, APR. 24, 2006 64 MX29LV800C T/B 48-Ball CSP (for MX29LV800CTXBC/BTXBI/BBXBC/BBXBI) P/N:PM1183 REV. 1.4, APR. 24, 2006 65 MX29LV800C T/B 48-Ball CSP (for MX29LV800CTXEC/BTXEI/BBXEC/BBXEI) P/N:PM1183 REV. 1.4, APR. 24, 2006 66 MX29LV800C T/B 48-Ball CSP (for MX29LV800CTXHC/BTXHI/BBXHC/BBXHI) Title: Package Outline for CSP 48BALL(4x6x1.0MM, BALL PITCH 0.5MM, BALL DIAMETER 0.32MM) TOP VIEW 6.00 0.08 BOTTOM VIEW 5.00 0.50 0.32 0.05 (48X) 6 5 4 3 2 1 LKJHGFEDCBA 4 6 5 4 3 2 1 ABCDEFGHJKL 4.00 0.08 2.50 0.50 A1 CORNER A1 INDICATOR DETAIL 0.63 0.10 SIDE VIEW 0.08 SEATING PLANE 0.20 0.06 Note: 1. Although many dimensions are similar to those of JEDEC Publication 95, MO-225, this specific package is not registered. 2. All linear dimensions are in millimeters. 3. Coplanarity: 0.08 mm P/N:PM1183 REV. 1.4, APR. 24, 2006 67 MX29LV800C T/B REVISION HISTORY Revision No. Description 1.0 1. Removed "Preliminary" 1.1 1. Added Pb-free package information for 44-SOP 2. Added "Recommended Operating Conditions" 1.2 1. Modified Erase Resume from delay 10ms to delay 400us 2. Added tCWC in table 12 1.3 1. Added access time:45Rns 1.4 1. Added 48-CSP(4x6mm) package 2. Added VLKO description Page P1 P57 P54 P16,37 P28 All P1,3,61,67 P20,23 Date MAY/12/2005 JUL/22/2005 JAN/12/2006 MAR/03/2006 APR/24/2006 P/N:PM1183 REV. 1.4, APR. 24, 2006 68 MX29LV800C T/B MACRONIX INTERNATIONAL CO., LTD. Headquarters: TEL:+886-3-578-6688 FAX:+886-3-563-2888 Europe Office : TEL:+32-2-456-8020 FAX:+32-2-456-8021 Hong Kong Office : TEL:+86-755-834-335-79 FAX:+86-755-834-380-78 Japan Office : Kawasaki Office : TEL:+81-44-246-9100 FAX:+81-44-246-9105 Osaka Office : TEL:+81-6-4807-5460 FAX:+81-6-4807-5461 Singapore Office : TEL:+65-6346-5505 FAX:+65-6348-8096 Taipei Office : TEL:+886-2-2509-3300 FAX:+886-2-2509-2200 MACRONIX AMERICA, INC. TEL:+1-408-262-8887 FAX:+1-408-262-8810 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. |
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